ICMEE 2021 - 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2021) edit

final submission deadline:2020.11.25
Geographical:Osaka, Japan
Call For Papers

ICMEE 2021 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.

Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc

{ History }

The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6

The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6

The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6

The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6

The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31

{ Submission Method }

1. Send your manuscript directly to conference official email: icmee

2. Submit your paper through easychair system:

{ Conference Scope }

The works that will be presented and published at conference will focus on, but are not limited to, the following topics:

Mechanical Engineering

Acoustics and Noise Control Marine System Design

Aerodynamics Material Engineering

Applied Mechanics Material Science and Processing

Automation, Mechatronics and Robotics Mechanical Design

Automobiles Mechanical Power Engineering

Automotive Engineering Mechatronics


{ Venue }

Osaka International Convention Center, Osaka, Japan

Add: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN

{ Contact }

Ms. Serene Lo



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