2019 The 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019) edit

BEGINS:2019.10.25
ENDS:2019.10.27
abstract submission deadline:2019.08.30
full paper submission deadline:2019.08.30
final submission deadline:2019.09.10
notification of acceptance date:2019.09.20
Geographical:Beijing, China
Organization:ICICM 2019
Contacts:Ms Sissi Chan
E-mail:icicm@young.ac.cn
Contact phone:+86-28-87777577
Conference Description

★ICICM 2019--IEEE Xplore,Ei Compendex and Scopus★

2019 The 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019)--Ei Compendex and Scopus
Time: October 25-27, 2019
Place: Beijing, China
http://www.icicm.net/

(For early submission, it will get the feedback within 1month)
==Publication: Conference Proceeding
==Indexed by: IEEE Xplore,Ei Compendex, and Scopus*
==Submission email:icicm@young.ac.cn (Or you still can submit to the submission system on website)
==Find the tempalte with the link:http://www.icicm.net/Template.doc

★ICICM Committees★
★Advisory Chairs
Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA
Prof. Meng-Fan (Marvin) CHANG, National Tsing Hua University (NTHU), Taiwan

★Conference Chairs
Prof. Zhigong Wang, Southeast University, China
Prof. Li Qiang, University of Electronic Science and Technology of China, China

★Conference Co-Chair
Prof. Gene Eu Jan, National Taipei University, Taiwan

★Program Chairs
Prof. Fei Yuan, Ryerson University, Canada
Prof. Zhi-Jian Xie, North Carolina A&T State University, USA

★Steering Committee Chair
Prof. Huang Le Tian, University of Electronic Science and Technology of China, China

★Technical Committee
Prof. Bo Yan, University of Electronic Science & Technology of China, China
Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India
Prof. Xiaoxiao Wang, BeiHang University, China
Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China
Prof. Jinzhao Wu, Guangxi University for Nationalities, China
Prof. Shiwei Feng, Beijing University of Technology, China
Assoc. Prof. Wei Ni, Hefei University of Technology, China
Assoc. Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications, China
Assis. Prof. Li Jiang, Shanghai Jiao Tong University, China
Prof. Jinyan Wang, Peking University, China
Prof. Zhi-Jian Xie, NC A&T State University, USA
Prof. S. Ushakumari, College of Engineering Trivandrum, India
Prof. Lu Tang, Southeast University, China
Prof. Haizhi Song, University of Electronic Science and Technology of China, China
Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China
Prof. Shiwei Feng, Beijing University of Technology,China
For more members, please visite conference website: http://www.icicm.net/committee.html


★★History
<ICICM2016|IEEE Publisher|Chengdu,China|Nov.23-25, 2016 >
Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

<ICICM2017|IEEE Publisher|Nanjing,China|Nov.8-11,2017>
Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

<ICIC2018|IEEE Publisher|Shanghai,China|Nov.24-26, 2018>
Papers of ICICM2018 can be checked in IEEE Xplore now!
Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5

★Support
1, Technical Support from IEEE
2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China

★Conference Contact
Ms Sissi Chan
Email: icicm@young.ac.cn
Tel: +86-28-87777577

Call For Papers


★TOPICS
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

Conference Speakers

Prof. Ljiljana Trajkovic, IEEE Fellow

Simon Fraser University, Canada

Ljiljana Trajkovic received the Dipl. Ing. degree from University of Pristina, Yugoslavia, in 1974, the M.Sc. degrees in electrical engineering and computer engineering from Syracuse University, Syracuse, NY, in 1979 and 1981, respectively, and the Ph.D. degree in electrical engineering from University of California at Los Angeles, in 1986.

She is currently a Professor in the School of Engineering Science at Simon Fraser University, Burnaby, British Columbia, Canada. From 1995 to 1997, she was a National Science Foundation (NSF) Visiting Professor in the Electrical Engineering and Computer Sciences Department, University of California, Berkeley. She was a Research Scientist at Bell Communications Research, Morristown, NJ, from 1990 to 1997, and a Member of the Technical Staff at AT&T Bell Laboratories, Murray Hill, NJ, from 1988 to 1990. Her research interests include high-performance communication networks, control of communication systems, computer-aided circuit analysis and design, and theory of nonlinear circuits and dynamical systems.

Dr. Trajkovic serves as IEEE Division X Delegate-Elect/Director-Elect (2018), IEEE Division X Delegate/Director (2019–2020). She serves as Senior Past President (2018–2019) of the IEEE Systems, Man, and Cybernetics Society and served as Junior Past President (2016–2017), President (2014–2015), President-Elect (2013), Vice President Publications (2012–2013, 2010–2011), Vice President Long-Range Planning and Finance (2008–2009), and a Member at Large of its Board of Governors (2004–2006). She served as 2007 President of the IEEE Circuits and Systems Society. She was a member of the Board of Governors of the IEEE Circuits and Systems Society (2001–2003, 2004–2005). She is Chair of the IEEE Circuits and Systems Society joint Chapter of the Vancouver/Victoria Sections. She was Chair of the IEEE Technical Committee on Nonlinear Circuits and Systems (1998). She is General Co-Chair of SMC 2020 and SMC 2018 Workshop on BMI Systems and served as General Co-Chair of SMC 2016 and HPSR 2014, Special Sessions Co-Chair of SMC 2017, Technical Program Chair of SMC 2017 and SMC 2016 Workshops on BMI Systems, Technical Program Co-Chair of ISCAS 2005, and Technical Program Chair and Vice General Co-Chair of ISCAS 2004. She served as an Associate Editor of the IEEE Transactions on Circuits and Systems (Part I) (2004–2005, 1993–1995), the IEEE Transactions on Circuits and Systems (Part II) (2018–, 1999–2001, 2002-2003), and the IEEE Circuits and Systems Magazine (2001–2003). She was a Distinguished Lecturer of the IEEE Circuits and Systems Society (2010–2011, 2002–2003). She is a Professional Member of IEEE-HKN and a Fellow of the IEEE.


Prof. Fei Yuan

Ryerson University, Canada

Fei Yuan received the B.Eng. degree in electrical engineering from Shandong University, Jinan, China in 1985, the M.A.Sc. degree in chemical engineering and Ph.D. degree in electrical engineering from University of Waterloo, Canada in 1995 and 1999, respectively. During 1985-1989, he was a Lecturer in the Department of Electrical Engineering, Changzhou Institute of Technology, Jiangsu, China. In 1989 he was a Visiting Professor at Humber College of Applied Arts and Technology, Toronto, Canada, and Lambton College of Applied Arts and Technology, Sarnia, Ontario, Canada. He was with Paton Controls Limited, Sarnia, Ontario, Canada as a Controls Engineer during 1989-1994 where he designed and commissioned total distributed control systems for petrochemical processes worldwide.

He joined the Department of Electrical and Computer Engineering, Ryerson University in 1999 as an Assistant Professor and was promoted to Associate Professor in 2003 and Full Professor in 2008. He served the department as the Associate Chair for Undergraduate Studies and Faculty Affairs from 2002 to 2006 and was the Chair of the department from 2010 to 2015. Dr. Yuan is a senior member of IEEE and a registered professional engineer in the province of Ontario, Canada.


Prof. Zou Zhuo

Fudan University, China

Zhuo Zou received the Ph.D. degree in Electronic and Computer Systems from KTH Royal Institute of Technology, Sweden, in 2012. Currently, he is with Fudan University Shanghai as a professor ("1000 talents plan" young scholar and PhD supervisor), where he is conducting research on integrated circuits and systems for IoT and ubiquitous intelligence. Prior to Fudan, he was the assistant director and a project leader at VINN iPack Excellence Center, KTH, Sweden, where he coordinated the research project on ultra-low-power embedded electronics for wireless sensing. Dr. Zou has also been an adjunct professor and docent at University of Turku, Finland.

Dr. Zou's primary research focus lies on smart electronic systems for IoT applications, including energy-efficient SoC, wireless sensing and perception, smart system integration and application, with outcomes by means of publications in journals/conferences and CMOS IC tape-outs. He authored and co-authored 70+ publications in international journals (incl. IEEE JSSC, IEEE TCAS) and conferences (incl. ISSCC, ESSCIRC).

 

 


Why attend this conference
  • ICICM 2019 which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, Scopus, and CPCI (Web of Science) after the conference.
  • Papers of ICICM2018 can be checked in IEEE Xplore now!
  • Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
  • Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
  • Technical Support from IEEE , Sponsored by University of Electronic Science and Technology of China and Southeast University, China
Related Conferences
  • There is no relevant meeting at this meeting.
 18      2      0